Multiband and Broadband Interference-Free Metallic Package Designs for Microwave Modules

Abstract

This letter presents a technique for designing metallic packages and cavities hosting RF and/or digital electronic systems for minimizing the unintentional coupling due to cavity resonances. The method involves an appropriate design of the conductive lid by adding periodic structures, unit cells (UCs), characterized by metal pins of appropriate length. The technique proposed herein, based on a quick analytical design procedure, demonstrates that the use of two different UCs arranged by following specific layouts is able to offer either multiple bandgaps or an ultrawide bandgap. Three UCs geometry are analyzed for bandgaps at X-, Ku-, and K-bands; they are combined to achieve the two above-mentioned bandgap responses aimed at X-Ku and X-K band applications. Both full-wave simulations and experimental results confirm the validity of the proposed technique.