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A Review of Vapor Chambers

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dc.contributor.authors Bulut, M; Kandlikar, SG; Sozbir, N;
dc.date.accessioned 2020-02-26T08:47:12Z
dc.date.available 2020-02-26T08:47:12Z
dc.date.issued 2019
dc.identifier.citation Bulut, M; Kandlikar, SG; Sozbir, N; (2019). A Review of Vapor Chambers. HEAT TRANSFER ENGINEERING, 40, 1573-1551
dc.identifier.issn 0145-7632
dc.identifier.uri https://doi.org/10.1080/01457632.2018.1480868
dc.identifier.uri https://hdl.handle.net/20.500.12619/50023
dc.description.abstract Future developments in electronic industries will require efficient cooling systems to dissipate large amount of heat produced over a small area. In recent years, interest has grown in extending the use of vapor chambers to high heat flux electronics cooling because of their low thermal resistance values and uniform temperature distribution abilities. A detailed overview of vapor chambers is presented in this paper including their principle of operation, types of performance characteristics, and various applications. Recent developments in improving the thermal performance of vapor chambers are also presented in this article.
dc.language English
dc.publisher TAYLOR & FRANCIS INC
dc.subject Mechanics
dc.title A Review of Vapor Chambers
dc.type Review
dc.identifier.volume 40
dc.identifier.startpage 1551
dc.identifier.endpage 1573
dc.contributor.department Sakarya Üniversitesi/Mühendislik Fakültesi/Makine Mühendisliği Bölümü
dc.contributor.saüauthor Sözbir, Nedim
dc.relation.journal HEAT TRANSFER ENGINEERING
dc.identifier.wos WOS:000488925400001
dc.identifier.doi 10.1080/01457632.2018.1480868
dc.identifier.eissn 1521-0537
dc.contributor.author Murat Bulut
dc.contributor.author Satish G. Kandlikar
dc.contributor.author Sözbir, Nedim


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