Preparation and Characterization of Copper Powders with Sn Coating by the Electroless Plating

Abstract

In this work, Sn-Cu composite powders were produced using an electroless process. The tin content on the surface of copper powders was vaned by using different concentrations of SnSO4 in the plating bath. The surface morphology of the produced Sn-Cu composite powders was characterized using scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) was used to determine the elemental surface composition of the composites. X-ray diffraction (XRD) analysis was performed to investigate the structure of the Sn-Cu composite powders. The electrochemical performance of Sn-Cu nanocomposites was studied by charge/discharge tests.