dc.contributor.authors |
Bulut, M; Kandlikar, SG; Sozbir, N; |
|
dc.date.accessioned |
2020-02-26T08:47:12Z |
|
dc.date.available |
2020-02-26T08:47:12Z |
|
dc.date.issued |
2019 |
|
dc.identifier.citation |
Bulut, M; Kandlikar, SG; Sozbir, N; (2019). A Review of Vapor Chambers. HEAT TRANSFER ENGINEERING, 40, 1573-1551 |
|
dc.identifier.issn |
0145-7632 |
|
dc.identifier.uri |
https://doi.org/10.1080/01457632.2018.1480868 |
|
dc.identifier.uri |
https://hdl.handle.net/20.500.12619/50023 |
|
dc.description.abstract |
Future developments in electronic industries will require efficient cooling systems to dissipate large amount of heat produced over a small area. In recent years, interest has grown in extending the use of vapor chambers to high heat flux electronics cooling because of their low thermal resistance values and uniform temperature distribution abilities. A detailed overview of vapor chambers is presented in this paper including their principle of operation, types of performance characteristics, and various applications. Recent developments in improving the thermal performance of vapor chambers are also presented in this article. |
|
dc.language |
English |
|
dc.publisher |
TAYLOR & FRANCIS INC |
|
dc.subject |
Mechanics |
|
dc.title |
A Review of Vapor Chambers |
|
dc.type |
Review |
|
dc.identifier.volume |
40 |
|
dc.identifier.startpage |
1551 |
|
dc.identifier.endpage |
1573 |
|
dc.contributor.department |
Sakarya Üniversitesi/Mühendislik Fakültesi/Makine Mühendisliği Bölümü |
|
dc.contributor.saüauthor |
Sözbir, Nedim |
|
dc.relation.journal |
HEAT TRANSFER ENGINEERING |
|
dc.identifier.wos |
WOS:000488925400001 |
|
dc.identifier.doi |
10.1080/01457632.2018.1480868 |
|
dc.identifier.eissn |
1521-0537 |
|
dc.contributor.author |
Murat Bulut |
|
dc.contributor.author |
Satish G. Kandlikar |
|
dc.contributor.author |
Sözbir, Nedim |
|