Finite Element Analysis of Interface Cracking in Semiconductor Packages

dc.contributor.authors	Ayhan, A. O., Nied, H. F.
dc.date.accessioned	2020-02-26T08:44:43Z
dc.date.available	2020-02-26T08:44:43Z
dc.date.issued	1999
dc.identifier.citation	Ayhan, A. O., Nied, H. F. (1999). Finite Element Analysis of Interface Cracking in Semiconductor Packages. IEEE Transactions on Components and Packaging Technologies, 22, 511-503
dc.identifier.uri	https://doi.org/10.1109/6144.814965
dc.identifier.uri	https://hdl.handle.net/20.500.12619/49691
dc.title	Finite Element Analysis of Interface Cracking in Semiconductor Packages
dc.identifier.volume	22
dc.identifier.startpage	503
dc.identifier.endpage	511
dc.contributor.department	Sakarya Üniversitesi/Mühendislik Fakültesi/Makine Mühendisliği Bölümü
dc.contributor.saüauthor	Ayhan, Ali Osman
dc.relation.journal	IEEE Transactions on Components and Packaging Technologies
dc.identifier.wos	SAU
dc.identifier.doi	10.1109/6144.814965
dc.contributor.author	Ayhan, Ali Osman